Advances in arrayed microcolumn lithography

Abstract
A microcolumn array has been designed, fabricated, and tested. The 2×2 array has a 2 cm pitch and operates at 1 keV. Key components include vertical interconnects, silicon low-distortion octupole deflectors, miniature long-range flexure-based tip positioners, and low-power thermal field emitters. Initial results show no observable crosstalk between columns during simultaneous operation at a 50 MHz beam blanking rate. Preliminary lithography results are presented.

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