Electromigration in AlSiCu/TiN/Ti interconnects with Ti and TiN additional layers
- 1 September 1994
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 12 (5) , 2992-2996
- https://doi.org/10.1116/1.587548
Abstract
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