Reaction-Bonded Boron Nitride-Aluminum Nitride Ceramic Composites
- 1 June 1991
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 30 (6R)
- https://doi.org/10.1143/jjap.30.1235
Abstract
Hexagonal boron nitride-aluminum nitride (h-BN-AlN, 75-25 wt%) ceramic composites are synthesized by reaction bonding. Metallic component-free, relatively dense composites are obtained by using h-BN and Al as starting materials and by optimizing sintering conditions. In comparison with reaction-bonded BN, higher bending strength, 98 MPa, and higher thermal conductivity, 66 W/(m·K), are attained for a Y2O3-added BN-AlN composite. A low thermal expansion coefficient of 2.6×10-6/K is also achieved.Keywords
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