Practical application of fine pitch component mounting with precoat soldering

30 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 22-30
https://doi.org/10.1109/iemt.1993.398226

Abstract

By combining the key capability of Super Solder precoat to supply high volumes of solder with the new pad geometry, major improvements are demonstrated in volume production mountability and mounting reliability for fine pitch components. In particular, a solder precoat supporting repair of a 0.3 mm pitch tape automated bonding (TAB) components is possible. A pad design permitting reflow mounting of quad flatpack (QFP) packages is discussed.

Keywords

SOLDERING
LEAD
TIN
SEMICONDUCTOR DEVICE PACKAGING
ELECTRONICS PACKAGING
LATTICES
PRODUCTION
BRIDGES
CHEMICAL TECHNOLOGY
LABORATORIES

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