The effect of ion implantation on cyclic stress-strain response of polycrystalline copper
- 1 November 1980
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 73 (1) , 209-219
- https://doi.org/10.1016/0040-6090(80)90353-3
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Crack nucleation and stage I propagation in high strain fatigue—II. mechanismActa Metallurgica, 1978
- Crack nucleation and stage I propagation in high strain fatigue—I. Microscopic and interferometric observationsActa Metallurgica, 1978
- The effect of ion plating on the low cycle fatigue behavior of copper single crystalsMaterials Science and Engineering, 1976