A study of electrical performance for next generation plastic packages
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 278-282
- https://doi.org/10.1109/ectc.1991.163890
Abstract
The authors compare the power and ground path inductance for three types of plastic packages. These packages are the 196 S/L PQFP (single-layer plastic quad flat pack), the 296 FR-PQFP (fine-pitch PQFP), and the 196 MM-PQFP (multilayer molded PQFP with one power and one ground plane). The S/L PQFP and the MM-PQFP packages are wirebonded and the FP-PQFP package is TAB (tape automated bonding) bonded. The authors also present plots of lead inductance as a function of the number of leads for the three packages and MM-PQFP plane inductance as a function of the number of leads. Simulations show that the MM-PQFP has the lowest power and ground path inductance while the S/L PQFP has the highest.Keywords
This publication has 2 references indexed in Scilit:
- High-performance PQFPPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Inductance calculation and optimal pin assignment for the design of pin grid array and chip-carrier packagesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003