Electronic and structural properties ofCu0.24Ni0.76(110) and thin films of Cu on Ni(110)

We have studied ${\mathrm{Cu}}_{0.24}$ ${\mathrm{Ni}}_{0.76}$(110) in the annealed and the ${\mathrm{Ar}}^{+}$-bombarded state and the system Cu on Ni(110) by means of angle-resolved photoemission, low-energy electron diffraction, ion scattering, and Auger electron spectroscopy. Cu overlayers on Ni(110) have been deposited in the range of 0.2–40 monolayers. The results are analyzed in terms of the surface electronic structure and the morphology of the surface region. The results from annealed ${\mathrm{Cu}}_{0.24}$ ${\mathrm{Ni}}_{0.76}$(110), where a Cu surface enrichment is generated by segregation, are similar to those from 3 monolayers of Cu on Ni(110). The Cu films do not simply condense in a layer-by-layer–type mode. The beginning of three-dimensional clustering and alloying effects is evident from the results.