A full-wave electromagnetic model of cylindrical and conical via hole grounds for use in interactive MIC/MMIC design

2 January 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

No. 0149645X,p. 1233-1236
https://doi.org/10.1109/mwsym.1992.188222

Abstract

An approximate yet accurate 3-D electromagnetic model of cylindrical and conical vias in microstrip is presented. The new model is formulated entirely in terms of the via physical parameters and has been verified against measured data to 40 GHz. Its extremely short execution times make it suitable for interactive CAD (computer-aided design).

Keywords

ELECTROMAGNETIC MODELING
MICROSTRIP
MMICS
CIRCUITS
ANALYTICAL MODELS
SOLID MODELING
ELECTRIC VARIABLES
ELECTROMAGNETIC ANALYSIS
STRIPS
DESIGN AUTOMATION

This publication has 2 references indexed in Scilit:

Modeling via hole grounds in microstrip
IEEE Microwave and Guided Wave Letters, 1991
Radiation from Via-Holes in MMICs
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1987