The Processing Windows for Selective Copper Chemical Vapor Deposition from Cu(hexafluoroacetylacetonate)trimethylvinylsilane
- 1 January 1995
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 142 (1) , 177-182
- https://doi.org/10.1149/1.2043861
Abstract
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