Measurement of Electroless Plating Rate for Copper and Nickel Baths by Coulostatic Method

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Abstract
The coulostatic method was studied for in situ measurement of electroless plating rate of copper from EDTA/HCHO and from Rochelle salt/HCHO baths and nickel from sodium citrate/sodium hypophosphite bath using copper electrodes immersed in stagnant electroless plating bath. Polarization resistance measured by this method showed reproducible inverse relation with deposition rate . The constant was largely dependent on the type of bath but was little affected by the changes in temperature or concentration of bath components. These characteristics of results in reproduciblein situ determination of electroless plating rate by this method. Comparing these results with these obtained by the galvanostatic linear polarization method, which also gives , it was shown that good reproducibility of the coulostatic measurements is mainly due to the following two characteristics. First, measured is almost free from solution resistance. Second, the measurement can be finished so rapidly, usually within a few ten milliseconds, that the surface state is little affected by it.

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