Multi chip modules for telecom applications

4 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 43-52
https://doi.org/10.1109/iemt8.1990.171088

Abstract

It is pointed out that the telecom system performance can be improved by the use of MCM (multichip modules) technology. Better signal transmission properties, lower power dissipation (if CMOS chips are used), and decreased physical volume will be obtained. Today MCM is an expensive technique, but a cost analysis shows that it has the potential of becoming more cost effective than the standard technique of using single-chip packages. It can also become more cost effective to use the MCM technique rather than increase the number of gates on the silicon chip over a certain level. In order to study the properties of the MCM technology, a project has been started at Ericsson Telecom in which a processor application is built up on three different types of MCM substrates.

Keywords

This publication has 1 reference indexed in Scilit:

Interconnection Costs of Various Substrates-The Myth of Cheap Wire
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984