Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy
- 1 November 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1286-1289
- https://doi.org/10.1007/s11664-999-0169-9
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Reliability of Soldered Joints: A Description of the State of the ArtSoldering & Surface Mount Technology, 1990