The Processing and Properties of Multilayer Interconnection Structures Using Thermoset Films Derived from Bisbenzocyclobutene.
- 1 January 1989
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
Multilayer interconnection structures incorporating a novel polymeric dielectric derived from a bis-benzocyclobutene(bis-BCB) monomer have been fabricated. This paper discusses the processing conditions for the construction of these circuits and describes electrical characteristics of the dielectric layers. The relative dielectric constant of the BCB film was 2.7. Thermal cycling produced no significant change in the conductance of three level metal via chains through two layers of the polymer.Keywords
This publication has 1 reference indexed in Scilit:
- Cost-Density Analysis of InterconnectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987