Adhesion measurement of thin films by indentation
- 24 November 1986
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 49 (21) , 1426-1428
- https://doi.org/10.1063/1.97343
Abstract
An indentation technique is described for measuring the shear strength of the interface between a thin film and a rigid substrate. A simple elastic/plastic analysis is used to describe the experimental results and good agreement between the two is found. The method may also be used to estimate the interfacial toughness so that the important parameters characterizing both initiation and propagation of adhesive failure may be determined from one simple experiment. The analysis is extended to describe the effect of residual stress in the film. Also, the stresses around a pinhole defect in a stressed film are examined.Keywords
This publication has 4 references indexed in Scilit:
- Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delaminationJournal of Applied Physics, 1984
- Measurements of adherence of residually stressed thin films by indentation. II. Experiments with ZnO/SiJournal of Applied Physics, 1984
- On the mechanics of delamination and spalling in compressed filmsInternational Journal of Solids and Structures, 1984
- Axi-symmetric contact on thin compliant coatingsJournal of the Mechanics and Physics of Solids, 1981