Thermally Induced Interfacial Stresses in Elongated Bimaterial Plates

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Abstract
The interfacial thermally induced shearing and peeling stresses in elongated bimaterial plates are determined on the basis of an elementary beam (long-and-narrow plate) theory. The utilized approach enables one to satisfy the stress-free boundary conditions at the short edges within the framework of an elementary analytical model. The obtained formulas are simple, easy-to-use, and clearly indicate how material and geometric characteristics affect the magnitude and the distribution of stresses. The suggested approach is applicable, generally speaking, to any elongated bimaterial or adhesively bonded structure, subjected to thermal or external loading. As an example of an external loading, we examine bending of a bimaterial plate on a circular mandrel. Such a test vehicle is being currently regarded by many reliability engineers in the microelectronics industry as an attractive means to evaluate attachment materials in adhesively bonded and soldered assemblies.

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