Particle removal from silicon wafer surface in wet cleaning process
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Semiconductor Manufacturing
- Vol. 6 (3) , 258-267
- https://doi.org/10.1109/66.238174
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Particle deposition and removal in wet cleaning processes for ULSI manufacturingIEEE Transactions on Semiconductor Manufacturing, 1992
- Dependence of thin-oxide films quality on surface microroughnessIEEE Transactions on Electron Devices, 1992
- A Mechanistic Study of Silicon Etching in NH 3 / H 2 O 2 Cleaning SolutionsJournal of the Electrochemical Society, 1990
- Particle-free wafer cleaning and drying technologyIEEE Transactions on Semiconductor Manufacturing, 1989