Some Effects of Temperature on Material Properties and Device Reliability
- 1 December 1972
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 8 (4) , 4-14
- https://doi.org/10.1109/tphp.1972.1136585
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
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