Thermal modeling and experimental techniques for microwave bipolar devices
- 1 January 1989
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Infrared Microscopy For Evaluation Of Silicon Devices And Die-Attach BondsPublished by SPIE-Intl Soc Optical Eng ,1977
- Thermal characterization of power transistorsIEEE Transactions on Electron Devices, 1976
- Liquid-crystal technique for observing integrated-circuit operationIEEE Transactions on Electron Devices, 1974
- Thermal conductivity of silicon, germanium, III–V compounds and III–V alloysSolid-State Electronics, 1967