New acceleration factors for temperature, humidity, bias testing
- 1 January 1979
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 26 (1) , 56-71
- https://doi.org/10.1109/t-ed.1979.19380
Abstract
New temperature-humidity acceleration factors for surface conductance (G) were determined. These can be used to relate device life in a high-stress laboratory environment to device life in a normal-use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.Keywords
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