Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988
Open Access
- 1 June 1990
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 112 (2) , 183-184
- https://doi.org/10.1115/1.2904361
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