Combination of Thick‐Film Dielectric/Thin Film Conductor for FinePattern Formation of Multi‐Layer Substrate
Open Access
- 1 January 1981
- journal article
- research article
- Published by Wiley in Active and Passive Electronic Components
- Vol. 8 (3-4) , 235-239
- https://doi.org/10.1155/apec.8.235
Abstract
Presented in this paper is a realization of Multi‐Layer Substrate with 30 μm signal pattern width and 100 μm square via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP” process, has been applied on a thick film dielectric layer. For the 100 μm square via holes through the thick film dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This paper describes the processes and the results obtained by the method.Keywords
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