An automated flip-chip assembly technology for advanced VLSI packaging
- 6 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 335-341
- https://doi.org/10.1109/ecc.1988.12614
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- The Effect of Joint Design on the Thermal Fatigue Life of Leadless Chip Carrier Solder JointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985