Residual stress anisotropy, stress control, and resistivity in post cathode magnetron sputter deposited molybdenum films

Publisher Website
Google Scholar
Abstract
As part of the program to develop a large-area thin-film pulse heater for a lithium ion source, the residual stress in post cathode magnetron sputter deposited molybdenum films has been studied. It was found that in films prepared in the low-pressure sputtering regime, the residual film stress is very sensitive to the gas pressure during sputtering and that the film stresses are highly anisotropic. The transition pressure for changing from compressive to tensile residual stress, as defined by Thornton and Hoffman, depends on the relationship between the measurement direction in the film and the post cathode orientation. In order to deposit a nearly stress-free film a pressure cycling technique was developed which deposited alternate film layers containing tensile and compressive stresses. Film resistivity and thermal coefficient of resistivity measurements were made during the pulse heating of the molybdenum films.

This publication has 0 references indexed in Scilit: