Conveyorised Horizontal System for PTH Using a Conductive Palladium Compound Direct Plate Process

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Abstract
With increasing environmental awareness, alternative processes for PTH “metallization” in PCB manufacture have been developed and are at various stages of commercialization. This paper describes one such process which uses a conductive palladium compound in place of electroless copper. Originally developed as a conventional vertical rack process it was quickly realized that the process time, being shorter than electroless systems, readily lent itself to conveyorized horizontal processing. The development of the horizontal process is detailed showing the use of statistical experimental techniques. Results obtained for a wide range of PCB types such as double sided, complex multilayer, rigid-flex and multiwire are presented as well as the capabilities on other substrates such as polyimide and cyanate ester.

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