An investigation of hardness and adhesion of sputter-deposited aluminum on silicon by utilizing a continuous indentation test
- 1 February 1988
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 3 (1) , 141-147
- https://doi.org/10.1557/jmr.1988.0141
Abstract
The hardness of aluminum films on silicon are measured as functions of depth of the indenter. The films have thicknesses of 0.25,0.5, and 1.0μm. The adhesion between one film and the substrate has been reduced through the prior deposition of a 10 nm layer of carbon. In each case the hardness is found to increase as the indenter approaches the film-substrate interface, but the rate of increase is greater for a film with good adhesion than for one with poor adhesion. It is suggested that this increase results from the constraint on deformation of the film by the substrate. A physical model is proposed whereby the yield stress of the film, σo, and an average effective shear strength τ of the indenter-film and film-substrate interfaces, may be determined from the data.Keywords
This publication has 2 references indexed in Scilit:
- Indentation-debonding of an Adhered Surface LayerThe Journal of Adhesion, 1979
- Ultra-microhardness of vacuum-deposited films II: Results for silver, gold,copper, MgF2, LiF and ZnSThin Solid Films, 1978