Reactive bonding of ceramics and metals (report 1). Reactive bonding of SiC and Cu using Cu-Mn liquid insert alloy.
- 1 January 1990
- journal article
- Published by Japan Welding Society in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
- Vol. 8 (2) , 192-196
- https://doi.org/10.2207/qjjws.8.192
Abstract
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