40-Gb/s IC and packaging technologies for future lightwave communications

10 April 1997

proceedings article
Published by SPIE-Intl Soc Optical Eng

Vol. 3038, 186-198
https://doi.org/10.1117/12.271459

Abstract

This paper reviews recent advances made at our laboratories in device, circuit-design, and module-design technologies for future very-high-speed lightwave communications. ICs and modules developed using 0.1 micrometer gate-length InAlAs/InGaAs HEMTs demonstrate promising performance suited to 40-Gb/s applications.

Keywords

INTEGRATED CIRCUITS
CIRCUIT DESIGN
PACKAGING

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