Acceleration Factors for Environmental Life Testing of Integrated Circuits

1 March 1971

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

No. 07350791,p. 228-232
https://doi.org/10.1109/irps.1971.362519

Abstract

This paper discusses an experiment to determine acceleration factors for temperature and humidity life testing based on a single, primary mode of failure. The acceleration parameters to be evaluated are temperature, humidity, voltage and encapsulation. A model is presented that explains the observed results and this is related to defect statistics.

Keywords

LIFE ESTIMATION
LIFE TESTING
LEAD
TEMPERATURE
HUMIDITY
PASSIVATION
ALUMINUM
CIRCUIT TESTING
INTEGRATED CIRCUIT INTERCONNECTIONS
CERAMICS

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