Abstract
High margin laser micromachining processes were developed lately in the aerospace industry for unique device manufacturing. These processes include precise laser ablation of cuts, grooves and holes in various media (silicon, sapphire, polyamides, etc.) with high aspect ratios (> 120:1) and dimensions close to 1 micrometer, while maintaining the integrity of neighboring integrated circuits. The relevance to biomedical therapeutic and surgical applications and to the interaction of lasers with soft and hard tissues is discussed.

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