Dielectric characterization of water sorption in epoxy resin matrices
- 1 January 1993
- journal article
- Published by Wiley in Polymer Engineering & Science
- Vol. 33 (2) , 75-82
- https://doi.org/10.1002/pen.760330204
Abstract
No abstract availableKeywords
This publication has 17 references indexed in Scilit:
- Dynamic‐mechanical and dielectric characterization of PEEK crystallizationPolymer Engineering & Science, 1990
- Analysis of the Dielectric Response of Thermosets During Isothermal and Nonisothermal CurePolymer Engineering & Science, 1989
- The effect of water on dielectric relaxations in the glassy states of poly(propylene oxide) and propylene glycolPolymer, 1988
- Environmental degradation of the electrical and thermal properties of organic insulating materialsJournal of Materials Science, 1988
- Dielectric relaxation due to absorbed water in various thermosetsPolymer, 1987
- Dielectric properties of an epoxy resin and its composite I. Moisture effects on dipole relaxationJournal of Applied Polymer Science, 1986
- Dielectric modeling of the curing processPolymer Engineering & Science, 1986
- Dielectric analysis of thermoset curePublished by Springer Nature ,1986
- Dielectric studies of water in epoxy resinsJournal of Applied Polymer Science, 1983
- Evaluation of structural changes in epoxy systems by moisture sorption‐desorption and dynamic mechanical studiesPolymer Composites, 1982