Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates
- 1 June 1992
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 114 (2) , 104-108
- https://doi.org/10.1115/1.2906404
Abstract
This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with three different initial microstructures by quenching, air-cooling, and furnace-cooling. The test results show that the quench-solidified solder joints have isothermal fatigue lives of about twice long as those of the furnace cooled solder joints tested at 20°C and 65°C with the straining rates of about 10−4 per s. These results are ascribed to the refined grain size and less lamellar phase morphology that results on increasing the cooling rate.Keywords
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