Thermal expansion of some engineering materials from 20 to 293°K
- 1 June 1962
- journal article
- Published by Elsevier in Cryogenics
- Vol. 2 (4) , 230-235
- https://doi.org/10.1016/0011-2275(62)90057-7
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Coefficients of Thermal Expansion of Solids at Low Temperatures. I. The Thermal Expansion of Copper from 15 to 300°K.Journal of the American Chemical Society, 1954