Grain size in evaporated nickel-aluminium films
- 15 October 1979
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 63 (1) , 87-92
- https://doi.org/10.1016/0040-6090(79)90104-4
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Composition-dependent structural and morphological changes in nickel-aluminium films prepared by co- evaporation of the pure metalsThin Solid Films, 1979
- High Rate Thick Film GrowthAnnual Review of Materials Science, 1977
- 1.6 Composition and stress state of thin films deposited by ion beam sputteringVacuum, 1977
- Metastable alloy phases by co-sputteringActa Metallurgica, 1976
- The origin of internal stress in low−voltage sputtered tungsten filmsJournal of Applied Physics, 1975
- Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatingsJournal of Vacuum Science and Technology, 1974
- Structural and electrical properties of chromium and nickel films evaporated in the presence of oxygenThin Solid Films, 1974
- A Hard-Sphere Model to Simulate Alloy Thin FilmsIBM Journal of Research and Development, 1965
- Metastable Alloy FilmsJournal of Vacuum Science and Technology, 1965