Detection by Auger Electron Spectroscopy and Removal by Ozonization of Photoresist Residues

1 April 1974

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium

No. 07350791,p. 180-186
https://doi.org/10.1109/irps.1974.362645

Abstract

Surface chemical analyses by Auger electron spectroscopy (AES) indicate that hydrocarbon residues are frequent contaminants on gold hybrid microcircuit metallization. The primary electron beam for AES cracks the hydrocarbon contaminants causing a carbonaceous residue. Lead frame bonding data demonstrated that a carbon residue approxi-mately 10 A thick was indicative of thermo-compression bond degradation. Concentrations of two percent ozone in oxygen can remove a photoresist layer approximately 200 A thick in 100 hours at room temperature. This restores thermocompression bondability of gold surfaces.

Keywords

ELECTRONS
SPECTROSCOPY
RESISTS
BONDING
HYDROCARBONS
GOLD
SURFACE CONTAMINATION
SURFACE CRACKS
CHEMICAL ANALYSIS
HYBRID INTEGRATED CIRCUITS

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