Lacquer initiated electroless deposits for RFI/EMI shielding
- 1 January 1987
- journal article
- research article
- Published by Taylor & Francis in Transactions of the IMF
- Vol. 65 (1) , 58-59
- https://doi.org/10.1080/00202967.1987.11870771
Abstract
A multilayer system of initiating lacquer, electroless copper and top coat of electroless nickel offers the desired characteristics of good shielding effectiveness combined with good corrosion resistance and stable low contact resistance It is suitable for selective application to the range of commonly used plastics using conventional techniques with reasonably low capital and material costs.Keywords
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