Characteristics of Adhesion between Photoresist and Inorganic Substrate

Publisher Website
Google Scholar
Abstract
The adhesion of positive photoresist film to some inorganic substrates used as LSI substrate material in dry and wet conditions has been investigated based on surface chemistry. The method of surface energy treatment is used to predict the adhesion energy. The contact angle method is used to measure the surface energy of each substrate. The correlation between the value of two components of surface energy, the polar and the dispersion parts, and adhesion strength is discussed. It is important to control the polar part of surface energy of a substrate in order to achieve high adhesion strength.