Numerical analysis on the cooling of a laser diode package with a thermoelectric cooler
- 18 June 2001
- journal article
- Published by Wiley in Heat Transfer
- Vol. 30 (5) , 357-370
- https://doi.org/10.1002/htj.1023
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Simultaneous determination of the thermal diffusivity of semiconductor lasers and resistance of their adhesive jointsInternational Journal of Heat and Mass Transfer, 1998