SOLIDIFICATION OF MOLTEN TIN DROP ON A NICKEL SUBSTRATE

1 January 1994

proceedings article
Published by Begell House

p. 73-78
https://doi.org/10.1615/ihtc10.1630

Abstract

Results of investigating the evolution of the thermal contact resistance between solidifying tin drop and nickel substrate are presented. Experimental equipment, measurement system and the procedure of experimental data processing are briefly described.

Keywords

EVOLUTION
DROP
THERMAL
PROCEDURE
SOLIDIFYING
EQUIPMENT
EXPERIMENTAL
SOLIDIFICATION
MOLTEN TIN

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