Effects of palladium and solder aging on mechanical and fatigue properties of tin-lead eutectic solder
- 1 November 1998
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (11) , 1223-1228
- https://doi.org/10.1007/s11664-998-0073-8
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- Isothermal Fatigue of 63Sn-37Pb SolderJournal of Electronic Packaging, 1990
- Superplastic behavior of PbSn eutectic alloyMaterials Science and Engineering, 1979
- Creep behaviour in the superplastic Pb–62% Sn eutecticPhilosophical Magazine, 1975