Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?
- 1 December 1989
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 111 (4) , 310-312
- https://doi.org/10.1115/1.3226553
Abstract
We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected to power cycling.Keywords
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