Effects of Mg additions on the electromigration behavior of Al thin film conductors
- 1 June 1975
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 4 (3) , 497-515
- https://doi.org/10.1007/bf02666232
Abstract
No abstract availableKeywords
This publication has 24 references indexed in Scilit:
- PrefaceThin Solid Films, 1975
- Grain-boundary solute electromigration in polycrystalline filmsJournal of Applied Physics, 1974
- Anomalous large grains in alloyed aluminum thin films II. Electromigration and diffusion in thin films with very large grainsThin Solid Films, 1973
- Lead sulphide-gallium antimonide heterojunctionsPhysica Status Solidi (a), 1973
- Electromigration and crevice formation in thin metallic filmsThin Solid Films, 1972
- Anomalous large grains in alloyed aluminum thin films I. Secondary grain growth in aluminum-copper filmsThin Solid Films, 1972
- Grain boundary contributions to transportSurface Science, 1972
- Effet de valence en electromigration dans l'argentJournal of Physics and Chemistry of Solids, 1970
- Current-induced mass transport in aluminumJournal of Physics and Chemistry of Solids, 1964
- Current-induced marker motion in gold wiresJournal of Physics and Chemistry of Solids, 1961