The effects of underfill on the reliability of flip chip solder joints
- 1 September 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (9) , 1017-1022
- https://doi.org/10.1007/s11664-999-0178-8
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- FEM Analysis of Thermal Stresses in Advanced Electronic PackagesMRS Proceedings, 1998