Thermal dry process soldering
- 1 May 1986
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology A
- Vol. 4 (3) , 838-840
- https://doi.org/10.1116/1.573786
Abstract
The use of nonflammable and nontoxic gases CF4, CF2Cl2, and SF6 for the reflow and bonding of Pb/Sn solder has been demonstrated. It has been found that a concentration of these gases on the order of 1%–5% in a 760 Torr atmosphere of nitrogen or argon is sufficient for soldering.Keywords
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