Solderability testing of Kovar with 60Sn40Pb solder and organic fluxes
- 1 May 1990
- report
- Published by Office of Scientific and Technical Information (OSTI)
Abstract
The solderability of 60Sn40Pb solder on Kovar was examined as a function of surface-cleaning procedure, flux, and solder-bath temperature. Organic-acid fluxes were more effective at lowering the contact angle than was a mildly activated, rosin-based (RMA) flux on chemically etched Kovar. The contact angles were as low as 29{degree} {plus minus} 5{degree} as compared to 61{degree} {plus minus} 11{degree}, respectively. Varying the solder temperature through the range of 215{degree}C to 288{degree}C caused an insignificant change in the contact angle for the RMA flux and a decrease of the contact angle for a candidate water-based, organic-acid flux. The dilution strength of the flux and the elapsed cleaning time significantly influenced the solder-flux interfacial tension, {sub {gamma}LF}. T-peel strengths of Kovar-60Sn40Pb-OFHC copper joints had a low correlation with the contact angle derived from the solderability experiments. The results of the solderability tests and the T-peel mechanical tests, and subsequence microanalysis of the as-soldered and T-peel samples revealed that the best results for the RMA flux were achieved by using an electropolishing procedure and a solder temperature of 240{degree}C to 260{degree}C. A relatively low contact angle of 31{degree} {plus minus} 2{degree} was observed, with no evidence of cracking or thick-film intermetallic formation atmore » the Kovar-solder interface. T-peel strengths were nominally 9.4{degree} {plus minus} 0.5 {times} 10{sup 6} dyn/cm. 21 refs., 36 figs., 11 tabs. « lessKeywords
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