High Rate Anodic Dissolution of Copper

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Abstract
The anodic dissolution of copper at current densities of 10–150 A/cm2 has been studied in neutral and solutions. An experimental flow system has been built which allows electrochemical measurements of the dissolution process to be performed under denned hydrodynamic conditions typical for the technical electrochemical machining operation. Design criteria for such a system have been analyzed. Copper dissolution proceeds in an active or a transpassive mode which differ in overvoltage by 10–20V. The onset of passivation seems to be due to the limiting mass transfer of dissolved metal from the electrode surface. The still higher dissolution rates in the passive state appear to be made possible by the removal of solid dissolution products. Etched, dull surfaces have resulted from active dissolution; pitted, bright surfaces from passive dissolution.

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