The Bonding Characteristics of Gold in Ultrahigh Vacuum
- 1 March 1974
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 10 (1) , 4-10
- https://doi.org/10.1109/tphp.1974.1134828
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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