Technological Advances in Fine Abrasive Processes
- 1 January 1997
- journal article
- Published by Elsevier in CIRP Annals
- Vol. 46 (2) , 545-596
- https://doi.org/10.1016/s0007-8506(07)60880-4
Abstract
No abstract availableKeywords
This publication has 157 references indexed in Scilit:
- Magnetic fluid grinding of HIP-Si3N4 rollersWear, 1996
- Cross-section transmission electron microscope observations of diamond-turned single-crystal Si surfacesApplied Physics Letters, 1994
- Magnetic fluid grinding mechanicsWear, 1994
- The combined effect of speed and humidity on the wear and friction of silicon nitrideWear, 1993
- Surface damage of CdTe by mechanical polishing investigated by cross-sectional TEMJournal of Crystal Growth, 1990
- Material removal mechanism of silicon nitride during rubbing in waterWear, 1984
- Precision Sawing with Wire SawCIRP Annals, 1983
- Indentation hardness and semiconductor–metal transition of germanium and siliconNature, 1978
- Some aspects of machining with negative rake tools simulating grindingInternational Journal of Machine Tool Design and Research, 1971
- The correlation of indentation experimentsJournal of the Mechanics and Physics of Solids, 1970