Maximizing step coverage during blanket tungsten low pressure chemical vapor deposition
- 31 December 1990
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 193-194, 51-60
- https://doi.org/10.1016/s0040-6090(05)80011-2
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Programmed Rate Processing to Increase Throughput in LPCVDJournal of the Electrochemical Society, 1990
- Prediction of Step Coverage during Blanket CVD Tungsten Deposition in Cylindrical PoresJournal of the Electrochemical Society, 1990
- Step coverage prediction in low-pressure chemical vapor depositionChemistry of Materials, 1989
- The Kinetics of LPCVD Tungsten Deposition in a Single Wafer ReactorJournal of the Electrochemical Society, 1986