Sensitivity of circuit peak thermal performance to convective and geometric variation
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 732-740
- https://doi.org/10.1109/33.49040
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Applying Heat Transfer Coefficient Data to Electronics CoolingJournal of Heat Transfer, 1990
- Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipmentInternational Journal of Heat and Mass Transfer, 1982