Characterization of chip scale packaging materials
- 1 September 1999
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 39 (9) , 1365-1377
- https://doi.org/10.1016/s0026-2714(99)00059-1
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated TemperaturesJournal of Engineering Materials and Technology, 1982